Engineering · 01 · Design
Hardware Engineering
Board-level design for systems where signal integrity, power, and thermals are non-negotiable.
What it is
We work with teams shipping into demanding environments — semiconductors, defense, industrial, medical — and the work assumes that environment from the first schematic, not the last design review.
Every engagement covers the analysis the board actually needs: signal integrity, power integrity, EMC, thermal, and DFM. Compliance scope (CE, FCC, RoHS) is scoped in up front so it doesn't surface as rework at the end.
Capabilities
- High-speed digital
- DDR4 / DDR5 memory interfaces
- PCIe Gen 3 / 4 / 5
- USB 3.x
- HDMI, DisplayPort
- Multi-gigabit Ethernet
- RF & microwave
- DC to 100+ GHz circuit design
- Antenna design and matching networks
- Filters, amplifiers, RF front-ends
- Cellular, Wi-Fi, Bluetooth, custom RF
- Mixed-signal & analog
- Precision data acquisition
- Sensor interfaces
- Low-noise amplification
- ADC / DAC integration
- Power & integrity
- Power supply and power management design
- High-power and high-temperature applications
- Signal and power integrity analysis
- EMC design, thermal analysis
- Design for manufacturability (DFM)
Often paired with
Firmware & Embedded Systems
Bare-metal and RTOS firmware on ARM, RISC-V, and Espressif — from board bring-up to OTA.
PCB Design & Layout
Two to seventy-six layers, including HDI, flex, rigid-flex, and high-speed — with SI/PI built into the routing, not bolted on at the end.
Manufacturing & Assembly
Prototype to production, SMT and through-hole, with sourcing and quality systems in the same engagement.