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Packaging & Test · Failure analysis

Failure Analysis & FIB Circuit Edit

FIB circuit edit down to 28nm, decap, delayering, and SEM imaging, so a first-silicon bug can be proven and patched before the next tape-out.

What it is

When first silicon doesn't behave, the expensive question is whether the fix needs a new mask set. FIB circuit edit answers it: cut and reroute metal on the actual die, prove the fix on the bench, and only then commit to a re-spin.

Failure analysis runs alongside it. We decap, delayer, and image down to the defect, and because the same team packaged the part and designed the board, the analysis starts with the full history instead of a box of returned units.

How a circuit edit works

A FIB edit in section: the beam cuts the old path, then gas-assisted deposition lays a platinum jumper to make the new one.

123456
  1. 1Focused ion beamMills and images at nanometer scale
  2. 2Gas injectionFeeds the precursor for deposition
  3. 3CutSevers the metal line to open the old path
  4. 4Platinum jumperDeposited line that makes the new connection
  5. 5ContactsMilled down to the metal, then filled
  6. 6PassivationOpened only where the edit needs it

From a failing part to the root cause

  1. 01LocalizePhoton emission finds the hot spot
  2. 02Cross-sectionFIB cuts through the exact site
  3. 03AnalyzeSEM imaging and EDX composition

Capabilities

Circuit edit
  • FIB circuit edit down to the 28nm node
  • Metal cuts and reroutes on the actual die
Failure analysis
  • Chemical and physical decap
  • Die extraction and delayering
  • SEM imaging from 50× to 200,000×
  • Backside FA sample prep
  • Hot-spot localization by photon emission (EMMI)
  • Cross-sections, TEM sample prep, voltage contrast
  • Remarking
Post-decap rework
  • Re-bonding, wire removal, and jumpers
  • Re-soldering and BGA reballing
  • Dispensing and re-molding
Competitive analysis
  • Teardown and construction analysis of third-party parts

FIB metal resistance

FIB-deposited metal resists more than CVD or bulk metal, and contacts more than lines. Rewires are sized to keep the deposited line under 10 Ω.

MetalBulkCVDFIB lineFIB contact
Tungsten (W)0.050.2370
Platinum (Pt)0.10.57140

Resistivity in Ω·µm.

Quality systems

  • ISO 9001

    Quality management

  • ISO 14001

    Environmental management

  • ISO 45001

    Occupational health & safety

Packaging and test performed in ISO 9001, ISO 14001, and ISO 45001-certified facilities. Certificates available under NDA.

Common questions

What's the smallest node you can FIB edit?
Circuit edit is supported down to the 28nm node.
Can you rebond or repackage a part after decap?
Yes. Post-decap rework covers re-bonding, wire removal, jumpers, re-soldering, BGA reballing, dispensing, and re-molding.
Do you do competitive teardown?
Yes. Teardown and construction analysis of third-party parts is part of the failure-analysis practice.

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