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Packaging & Test · Qualification

Reliability Qualification & Electrical Test

HTOL, HAST, THB, temperature cycling, ESD, and latch-up for new parts, plus the burn-in boards and DUT cards to run them.

What it is

Qualification is where NPI schedules slip quietly. The test plan is fine; what's missing is the burn-in board, the socket, or a lab slot that lines up with when parts come off the packaging line.

We run qualification on the same engagement as packaging, so parts move straight from assembly into stress, and the burn-in boards and DUT cards come with it. When something fails, failure analysis is part of the same engagement rather than another purchase order.

Chamber ranges

The test chambers span −65 °C to 200 °C between them. HAST and the pressure cooker add humidity and pressure.

-50050100150200
  • Thermal shock−65 to 150
  • Temperature cycling−65 to 150
  • Temperature-humidity−65 to 150, 20–98 %RH
  • High-temperature oven25 to 200
  • HAST105 to 150, 65–100 %RH
  • Pressure cooker121, 100 %RH, 15 psig

°C

Burn-in boards, turnkey

  1. 01SizeSockets, power, and per-pin current set the board count
  2. 02DesignSchematic and layout on high-Tg, polyimide, or FR4
  3. 03BuildSMT assembly
  4. 04DebugBrought up before the parts go in

Capabilities

Life & bias stress
  • HTOL: high-temperature operating life
  • HTRB / HTGB: high-temperature reverse and gate bias
  • H3TRB: high-humidity, high-temperature reverse bias
  • BLT: bias life test
Environmental stress
  • HAST: highly accelerated stress test
  • THB: temperature-humidity bias
  • PCT: pressure cooker test
  • TCT: temperature cycling
  • THST / THCT: thermal shock and thermal cycling variants
  • HTST / LTST: high- and low-temperature storage
Assembly robustness
  • MSL preconditioning, levels 1 to 6
  • Reflow simulation
Electrical test
  • ESD: HBM, MM, CDM
  • Latch-up
  • Wafer probe (CP)
  • Final test (FT)
Burn-in boards
  • HTOL, THB, HAST, H3TRB, HTGB, and HTRB boards
  • Turnkey: schematic, layout, SMT, and debug
  • High-Tg, polyimide, and FR4 materials
  • Board count sized from sockets, power, and per-pin current
  • DUT cards and custom test fixtures

Quality systems

  • ISO 9001

    Quality management

  • ISO 14001

    Environmental management

  • ISO 45001

    Occupational health & safety

Packaging and test performed in ISO 9001, ISO 14001, and ISO 45001-certified facilities. Certificates available under NDA.

Common questions

Which reliability tests do you run?
HTOL, HTRB, HTGB, H3TRB, BLT, HAST, THB, PCT, TCT, THST, THCT, HTST, LTST, MSL preconditioning, and reflow, plus ESD (HBM, MM, CDM) and latch-up.
Do you provide burn-in boards?
Yes, turnkey: we size the sockets and board count from your schematic and package drawing, then design, lay out, assemble, and debug the boards. That removes the most common wait in a qualification schedule.
Can you package and qualify the same lot?
Yes. Packaging, qualification, and failure analysis run on one engagement, so parts move from assembly into stress without a handoff.

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