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Packaging & Test · Plastic

Quick-Turn Plastic Packaging

Small-batch molded packages from 3-pin SOT to 256-pin LQFP, so engineering samples ship in the package production will use.

What it is

Testing first silicon in the package it will ship in catches the problems a ceramic sample hides: mold stress, wire sweep, thermal paths that only exist in plastic. Large assembly houses rarely want a lot that small.

We run quick-turn plastic packaging at prototype and pilot volumes across the standard families below. Bring the die and the target package and we'll confirm the bond plan. Because the board team is on the same engagement, footprint and thermal pad questions get answered before the part is molded.

Inside the package

A wire-bonded QFN in section, the most common quick-turn plastic package: leadless, with an exposed pad underneath.

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  1. 1Mold compoundEpoxy molded over the die and wires
  2. 2Bond wiresDie pads to the leads
  3. 3DieAttached to the exposed pad
  4. 4Exposed padSolders to the board for heat and ground
  5. 5LeadsFlat lands on the package edge

The plastic line

Fourteen steps from incoming wafer to packed parts, the same flow at prototype and pilot volume.

  1. 01Wafer in
  2. 02 · WGGrind
  3. 03 · WSSaw
  4. 04 · DADie attach
  5. 05 · ECEpoxy cure
  6. 06 · WBWire bond
  7. 07 · MDMold
  8. 08 · PMCPost-mold cure
  9. 09 · SPPlating
  10. 10 · TMTop mark
  11. 11 · TFTrim and form
  12. 12Test
  13. 13 · LSLead scan
  14. 14 · PKPack

Capabilities

Package families
  • QFN and DFN
  • LQFP, plus eLQFP / HLQFP with heat slug
  • SOP, SSOP, TSSOP, MSOP, eSOP
  • DIP
  • SOT and TO power packages
  • Plastic BGA
Around the package
  • Wafer thinning, dicing, and die sort
  • MSL preconditioning and reflow
  • Final test (FT)

Plastic package catalog

Standard quick-turn plastic packages, small batch. Bring the die and the target package and we'll confirm the bond plan.

  • SOT3, 5, 6 pins
  • SOP8–32 pins
  • QFN12–100 pins
  • LQFP32–256 pins
  • CDIP8–64 pins, ceramic
  • BGA2–29 mm body
PackagePinsBody size
LQFP32–2565×5 to 28×28 mm
eLQFP / HLQFP (heat slug)80, 128, 144, 17612×12 to 20×20 mm
QFN12–1002×2 to 10×10 mm, 12×12 mm
DFN8–162×3 to 5×6 mm
DIP8–48Standard
SOP8–32Standard
SSOP8–28Standard
TSSOP8–30Standard
eSOP8, 28Standard
MSOP8, 10Standard
SOT3, 5, 6Standard
TO90, 94, 220, 247, 251, 252, 263Standard

Ceramic, COB, BGA, LGA, and MEMS packages are quoted per die and drawing.

BGA, LGA, SiP & MEMS

Array, system-in-package, and sensor packages, quick-turn.

FamilySpecRange
BGABody size2×2 to 29×29 mm
BGAMold thickness0.55 to 1.5 mm
BGABalls and pitchFrom 0.2 mm balls at 0.4 mm pitch
LGABody size2×2 to 20×12 mm
LGAMold thickness0.55 to 1.5 mm
SiPConfigurationsSide by side, stacked die, IC plus passives
SiPAssemblyWire bond, flip chip, and SMT in one package
BumpingBall attachSingle die and wafers up to 6 in; balls from 60 µm
MEMSPackage styleOpen-cavity or windowed; windows from 0.6 mm

Ceramic BGA is built to drawing; see ceramic packaging.

Quality systems

  • ISO 9001

    Quality management

  • ISO 14001

    Environmental management

  • ISO 45001

    Occupational health & safety

Packaging and test performed in ISO 9001, ISO 14001, and ISO 45001-certified facilities. Certificates available under NDA.

Common questions

What plastic packages can you build in small batches?
QFN, DFN, LQFP (including heat-slug variants), SOP, SSOP, TSSOP, MSOP, eSOP, DIP, SOT, TO, and BGA. Pin counts and body sizes are listed in the catalog on this page.
Do you support exposed-pad and heat-slug packages?
Yes. eLQFP / HLQFP in 80, 128, 144, and 176 pins, and eSOP in 8 and 28 pins.
Can the same team design the board the part goes on?
Yes. That's the point of running packaging inside an engineering studio: the package, footprint, and board are decided together.

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