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Packaging & Test · Wafer

Wafer Thinning, Dicing & Die Sort

Thinning to 50 µm, laser and blade dicing, SiC stealth dicing, GaAs laser dicing, and automated die sort for MPW, shuttle, and full wafers.

What it is

Most quick-turn packaging starts before the package. An MPW shuttle comes back as a wafer shared with other designs, and your die have to be thinned, cut out, and sorted before anyone can bond them.

We thin and dice wafers from 2 to 12 inches, cut MPW and shuttle wafers by block, and sort die by ink or wafer map into trays or wafer frames. The die go straight into packaging on the same engagement.

From shuttle wafer to packaged die

  1. 01ThinGrind to target, polish if needed
  2. 02DiceLaser, blade, or stealth
  3. 03SortBy ink or wafer map
  4. 04PackageStraight into the build

Capabilities

Thinning
  • Wafers from 2 to 12 in, plus bare die, blocks, and MPW
  • 8 and 12 in: down to 50 µm without bumps
  • 150 µm with solder bumps, 200 µm with gold bumps
  • 6 in and smaller: 70 µm, or 60 µm on engineering lots
  • Polish recommended below 150 µm, or 250 µm when bumped
Dicing
  • Laser dicing, kerf from 20 µm
  • Blade dicing, kerf from 50 µm
  • SiC stealth dicing
  • GaAs laser dicing
  • MPW and shuttle wafers cut by block, including 5×5
  • Die or substrate up to 1.0 mm thick
Die sort and handling
  • Input wafers 3 to 12 in; output to 2–4 in trays or 8 in frames
  • Sort by ink or wafer map
  • Die from 180 µm across and 65 µm thick
  • Tape transfer, including one wafer split across frames
  • About 15 million die a month
  • Vacuum anti-static packing
Marking
  • Laser marking

Volume capacity

Production thinning and dicing per wafer size. Engineering lots can go thinner: 50 µm on 8 and 12 in.

WaferMinimum thicknessMinimum kerfWafers a month
4 and 5 in70 µm50 µm5,000 each
6 in70 µm20 µm laser, 50 µm blade5,000
8 in70 µm; 150 µm solder bump; 200 µm gold bump50 µm5,000
12 in75 µm; 150 µm solder bump; 200 µm gold bump50 µm; 60 µm bumped5,000

Quality systems

  • ISO 9001

    Quality management

  • ISO 14001

    Environmental management

  • ISO 45001

    Occupational health & safety

Packaging and test performed in ISO 9001, ISO 14001, and ISO 45001-certified facilities. Certificates available under NDA.

Common questions

Can you dice our die out of an MPW shuttle wafer?
Yes. MPW and shuttle wafers are cut by block, including 5×5 layouts, and the die are sorted for packaging.
How thin can you go?
Down to 50 µm on 8 and 12 in wafers without bumps, 150 µm with solder bumps, and 200 µm with gold bumps.
Do you dice SiC and GaAs?
Yes: stealth dicing for SiC and laser dicing for GaAs.

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